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By using a dedicated chamber for rinsing and drying, precise cleaning is possible.
The cassette is set in the loader, and the substrate is transported using a chemical-resistant clean robot. Chemical processing is performed in Chamber A, rinsing in Chamber B, followed by spin drying, and then the substrate is stored in the cassette set in the unloader. This is a single-wafer automatic multi-spin processor.
During scanning, uniformity improvement through peripheral speed control is also possible! We have received numerous uses and have a wealth of experience compared to conventional methods.
This is an introduction to a device that performs a series of patterning processes, including developing, etching, rinsing, and drying, using a conventional spin method. Depending on the substrate type, it allows for the selection of spray or paddle recipes during the developing and etching processes, and it can also improve uniformity through speed control during scanning. This machine is low-cost and has a wealth of experience with numerous users, but the process for recycling requires a two-chamber setup. If proper separation of waste liquid, drainage, and exhaust is necessary, we will respond with a new type of UDS device. *For more details, please refer to the PDF materials or feel free to contact us.*
With just one unit, it can handle various processes such as coating, cleaning, and etching! It is resistant to chemicals and can easily remove dirt!
Are you struggling with the fact that coating, cleaning, and etching processes are handled separately on different machines, leading to increased labor and a desire to shorten the process? The resin-based multifunctional spin processor 'POLOS' from Kyodo International can solve this problem. It can handle various processes such as coating, cleaning, and etching all in one machine! You can also choose between a desktop type and a mini wet station type. 【Features】 ■ Since it is made entirely of resin... - Easy to use = can be easily cleaned even if it gets dirty - Versatile = can be used for etching, developing, spin drying, etc. - Strong against chemicals! (Polypropylene or Teflon) ■ With a brushless motor... - Accurately rotates even heavy substrates - Allows for acceleration speed settings, reverse rotation, and paddle operation settings - Maximum rotation speed of 12,000 rpm, capable of coating high-viscosity materials ■ With a wealth of options and expandability... - Supports chip sizes up to large substrates (□1000mm) - Various holding methods such as vacuum chucks and mechanical chucks For more details, please contact us or download the catalog.
By combining spin and spray, we achieved a high-precision and uniform process.
The WET process device Multi-Spin Processor performs developing/etching/drying processes on substrates using a spray method. The WET device technology from Denshi Giken Co., Ltd., including cleaning and other spin processes, can meet the needs of a wide range of industries such as semiconductors, LCD, medical, and food industries, starting with wafers and glass substrates, as well as cleaning printed circuit boards and metal substrates for various applications. 【Features】 - Achieves high precision and uniform processes through the combination of spin and spray - Transport by double-hand robot - Parallel processing of developing/etching/drying processes - Equipped with cup cleaning function - Realizes quick drying with N2 blow and high-speed spin rotation For more details, please contact us or download the catalog.
By using a dedicated chamber for rinsing and drying, precise cleaning is possible.
Set the cassette in the loader and transport the substrate using a chemical-resistant clean robot. Chemical processing is done in Chamber A, rinsing in Chamber B, followed by spin drying, and then the processed cassette is stored in the unloader. This is a single-wafer automatic multi-spin processor.
